Part # FDZ206P datasheet

Part Manufacturer: Fairchild Semiconductor

Fairchild Semiconductor

Part Description: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSF

Part Details:

FDZ February 2006 2 06 P P-C FDZ206P han P-Channel 2.5V Specified PowerTrench® BGA MOSFET ne l 2.5 General Description Features V S Combining Fairchild s advanced 2.5V specified p PowerTrench process with state of the art BGA · ­13 A, ­20 V. rDS(on) = 9.5 m @ VGS = ­4.5 V e packaging, the FDZ206P minimizes both PCB space r c DS(on) = 14.5 m @ VGS = ­2.5 V i and r f DS(on). This BGA MOSFET embodies a ie breakthrough in packaging technology which enables · Occupies only 14 mm2 of PCB area. d the device to combine excel ent thermal transfer Only 42% of the area of SO-8 P characteristics, high current handling capability, ultra- o low profile packaging, low gate charge, and low r · Ultra-thin package: less than 0.80 mm height when DS(on). w mounted to PCB e Applications r · 0.65 mm bal pitch Tr · e Battery management

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FDZ206P.pdf Datasheet