Part # AN471 datasheet

Part Manufacturer: ST Microelectronics

ST Microelectronics


Part Details:

AN471 APPLICATION NOTE SMART POWER TECHNOLOGIES FOR POWERTRAIN & BODY ELECTRONICS by R. Ferrari Smart power ICs are becoming increasing by common in automotive powertrain and body electronics.This note provides a general introduction to the subject. As is well known, electronics is slowly but progressively invading every part of the automotive environment (fig-ure 1); entering first in the car radio, it has extended progressively and is now present in all of the subsystemsof an automobile. For those people who prefer a "historical" approach, the evolution of auto electronics has beendivided into three main sections, each subdivided into various phases, correlated with the state of the art in gen-eral electronics at that time. Today, at the beginning of the 90 s we are in the SMART POWER phase, and it isprecisely that which we intend to discuss briefly here (see fig. 2).We will look at, first of all, some definitions: smart power or intelligent power indicates those families of integrat-ed circuits which include both logic control circuits and components capable of delivering a significant amountof power to a generic load. In numbers, a circuit can be considered smart power if it is able to deliver more than0.5A to the load, or of withstanding more than 50V, or able to supply a power of at least 1W to the load.Over the years STMicroelectronics has developed various technologies that allow the realization of smart powercircuits (figure 3). The simplest way to classify these technologies is to refer to the process type, which can bepurely bipolar or mixed, that is, including on a single piece of silicon both MOS structures (of control and power)and bipolar structures. Another method (figure 4) is to examine the way in which the current flows through thepower section; horizontal, with the current entering and leaving through the upper surface, or vertical, where thecurrent enters through the upper surface and leaves through the lower surface; for this lower connection insteadof wire the tie bar of the package is used.The choice of one technology rather than another depends on various elements (figure 5) but simplifying as faras possible the criteria, we can say that vertical technologies can guarantee, for a given area, lower resistancesbut they have the limitation of being able to include just one power device per circuit (or more than one, but al-ways with the collectors or drains short-circuited); while Figure 1. Electronics in present and future automobiles. SAFETY & CONVENIENCE BODY CONTROL POWER TRAIN DRIVER INFORMATION Rear Window Defogger Cruise Control Ignition Digital Gauges Climate Control Intermittent Wipar Spark Timing Digital Clock Keyless Entry Antitheft Devices Voltage Regulator Multitons Alarms Automatic Door Lock Electr. Suspension Alternator Engine Diagn. Results Light Drimmer Electr. Steering Idle Speed control Service Reminders Traction Control Multiplex Wiring Turbo Control Miles to Empty Antiskid Braking Module to Module Emission System Shift Indicator Window Control Communications Transmiss. Control Head-up Display Memory Seat Load Sensit. Braking Diagnostics CRT Display Heasted Windshield Hard/Soft Ride Control Audio Annunciator Voice Controlled Trunk Airbag Restraints November 2003 1/10

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