Part # ds005 datasheet

Part Manufacturer: Xilinx

Xilinx

Part Description: Xilinx XC4000XL FPGA Electrical Specifications data sheet v 1.8 (10 99)


Part Details:

R XC4000E and XC4000X Series Field Programmable Gate Arrays XC4000XL Electrical Specifications Definition of Terms In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined asfollows: Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, ordevicefamilies. Values are subject to change. Use as estimates, not for production. Preliminary: Based on preliminary characterization. Further changes are not expected. Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final. Except for pin-to-pin input and output parameters, the a.c. parameter delay specifications included in this document arederived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junctiontemperature conditions. All specifications subject to change without notice. XC4000XL D.C. Characteristics Absolute Maximum Ratings Description Units VCC Supply voltage relative to Ground -0.5 to 4.0 V VIN Input voltage relative to Ground (Note 1) -0.5 to 5.5 V 6 VTS Voltage applied to 3-state output (Note 1) -0.5 to 5.5 V VCCt Longest Supply Voltage Rise Time from 1 V to 3V 50 ms TSTG Storage temperature (ambient) -65 to +150 °C TSOL Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm) +260 °C Ceramic packages +150 °C TJ Junction Temperature Plastic packages +125 °C Note 1: Maximum DC excursion above Vcc or below Ground must be limited to either 0.5 V or 10 mA, whichever is easier to achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot toVCC +2.0 V, provided this over or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA. Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These arestress ratings only, and functional operation of the device at these or any other conditions beyond those listed underRecommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extendedperiods of time may affect device reliability.


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