Part # Brief STLC2690 datasheet

Part Manufacturer: ST Microelectronics

ST Microelectronics

Part Description: Bluetooth V2.1 and FM RDS transceiver system-on-chip

Part Details:

IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of STMicroelectronics have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. Company name - STMicroelectronics NV is replaced with ST-NXP Wireless. Copyright - the copyright notice at the bottom of the last page "© STMicroelectronics 200x - All rights reserved", shall now read: "© ST-NXP Wireless 200x - All rights reserved". Web site - is replaced with Contact information - the list of sales offices is found at under Contacts. If you have any questions related to the document, please contact our nearest sales office. Thank you for your cooperation and understanding. ST-NXP Wireless STLC2690 Bluetooth V2.1 and FM RDS transceiver system-on-chip Data Brief Features Description Addition of the FM transmit functionality to The STLC2690 combines Bluetooth V2.1 + EDR Bluetooth and FM radio combo system-on-chip and FM R(B)DS transceiver functionality on a ­ Send music content stored on a portable single chip designed in ST low power 65 nm device to any in-car or home FM tuner RFCMOS process. The device is fully optimized system for mobile phones, smart phones, PDAs and ­ SureTuneTM technology to select the portable multimedia player applications. The optimal FM transmit frequency required board space has been minimized. Power consumption levels are optimized for battery Simultaneous operation of Bluetooth and FM powered devices and the high integration level Very low power consumption for battery allows a cost effective solution. The low external powered devices BOM count allows easy integration of the ­ Designed in ST s low power 65 nm STLC2690 into products, enabling short time to RFCMOS technology market. Increased link budget for both Bluetooth and Figure 1. Block diagram FM to improve the connection stability Small PCB footprint ­ WLCSP package, 0.6 mm height and 0.4 mm pitch

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Brief STLC2690.pdf Datasheet